multilayer ceramic capacitors high q / low esr series (hh) 00 - t006 g - as_hh revisiong mar.09,2010 1/7 walsin technology corporation 566-1,kao-shi road, 5 lin, yang-mei, tao-yuan, taiw an www.passivecomponent.com 1. introduction mlcc consists of a conducting material and electrod es. to manufacture a chiptype smt and achieve miniaturization,highdensityandhighefficiency, ceramiccondensersareused. wtchhseriesmlccisusedathighfrequenciesgene rallyhaveasmalltemperaturecoefficientofcapac itance, typicalwithinthe 30ppm/ crequiredfornp0(c0g)classificationandhaveex cellentconductivityinternalelectrode. thus,wtchhseriesmlccwillbewiththefeatureo flowesrandhighqcharacteristics. 4. how to order hh 15 n 100 g 500 l t series hh =highq/ lowesr size 15 =0402(1005) 18 =0603(1608) 21 =0805(2012) dielectric n =np0 (c0g) capacitance twosignificant digitsfollowedby no.ofzeros.and risinplaceof decimalpoint. eg.: r47=0.47pf 0r5=0.5pf 1r0=1.0pf 100=10x10 0 =10pf tolerance b =0.1pf c =0.25pf d =0.5pf f =1% g =2% j =5% rated voltage twosignificant digitsfollowedby no.ofzeros.and risinplaceof decimalpoint. 160 =16vdc 250 =25vdc 500 =50vdc 101 =100vdc termination l =ag/ni/sn packaging t =7reeled g =13reeled 2. features a. highqandlowesrperformanceathighfrequency. b. qualityimprovementoftelephonecallsforlow powerlossandbetterperformance. 3. applications a. mobiletelecommunication:mobilephone,wlan. b. rfmodule:poweramplifier,vco. c. tuners.
multilayer ceramic capacitors high q / low esr series (hh) 00 - t006 g - as_hh revisiong mar.09,2010 2/7 walsin technology corporation 566-1,kao-shi road, 5 lin, yang-mei, tao-yuan, taiw an www.passivecomponent.com 5. external dimensions 6. general electrical data dielectric np0 size 0402,0603,0805 capacitance* 0402:0.1pfto470pf 0603:0.5pfto3300pf 0805:0.5pfto150pf capacitance tolerance cap5pf:b(0.1pf),c(0.25pf) 5pf470pf: 5 00m @6 0 10mhz termination ni/sn(leadfreetermination) *measuredattheconditionsof25cambienttemper atureand30~70%relatedhumidity. apply1.00.2vrms,1.0mhz10%forcap1000pfand1. 00.2vrms,1.0khz10%forcap>1000pf. t w l m b m b fig.1theoutlineofmlcc size inch (mm) l (mm) w (mm) t (mm)/symbol m b (mm) 0402(1005) 1.000.05 0.500.05 0.500.05 n 0.25 +0.05/0.10 0603(1608) 1.600.10 0.800.10 0.800.07 s 0.400.15 0805(2012) 2.000.15 1.250.10 0.600.10 a 0.500.20 #0402size:reflowsolderingonly.
multilayer ceramic capacitors high q / low esr series (hh) 00 - t006 g - as_hh revisiong mar.09,2010 3/7 walsin technology corporation 566-1,kao-shi road, 5 lin, yang-mei, tao-yuan, taiw an www.passivecomponent.com 7. capacitance range dielectric np0 size 0402 0603 0805 rated voltage (vdc) 16 25 50 16 25 50 100 50 100 0.1pf (0r1) n n n 0.2pf (0r2) n n n 0.3pf (0r3) n n n 0.4pf (0r4) n n n 0.5pf (0r5) n n n s s s s a a 0.6pf (0r6) n n n s s s s a a 0.7pf (0r7) n n n s s s s a a 0.8pf (0r8) n n n s s s s a a 0.9pf (0r9) n n n s s s s a a 1.0pf (1r0) n n n s s s s a a 1.2pf (1r2) n n n s s s s a a 1.5pf (1r5) n n n s s s s a a 1.8pf (1r8) n n n s s s s a a 2.2pf (2r2) n n n s s s s a a 2.7pf (2r7) n n n s s s s a a 3.3pf (3r3) n n n s s s s a a 3.9pf (3r9) n n n s s s s a a 4.7pf (4r7) n n n s s s s a a 5.6pf (5r6) n n n s s s s a a 6.8pf (6r8) n n n s s s s a a 8.2pf (8r2) n n n s s s s a a 10pf (100) n n n s s s s a a 12pf (120) n n n s s s s a a 15pf (150) n n n s s s s a a 18pf (180) n n n s s s s a a 22pf (220) n n n s s s s a a 27pf (270) n n n s s s s a a 33pf (330) n n n s s s s a a 39pf (390) n n n s s s s a a 47pf (470) n n n s s s s a a 56pf (560) n n n s s s s a a 68pf (680) n n n s s s s a a 82pf (820) n n n s s s s a a 100pf (101) n n n s s s s a a 120pf (121) n n n s s s s a a 150pf (151) n n n s s s s a a 180pf (181) n n n s s s s 220pf (221) n n n s s s s 270pf (271) n n s s s s 330pf (331) n n s s s s 390pf (391) n n s s s s 470pf (471) n n s s s s 560pf (561) s s s 680pf (681) s s s 820pf (821) s s s 1,000pf (102) s s s 1,200pf (122) x 1,500pf (152) x 1,800pf (182) x 2,200pf (222) x 2,700pf (272) x capacitance 3,300pf (332) x 1.theletterincellisexpressedthesymbolofpr oductthickness. 2.formoreinformationaboutproductswithspecial capacitanceorotherdata,pleasecontactwtcloca lrepresentative.
multilayer ceramic capacitors high q / low esr series (hh) 00 - t006 g - as_hh revisiong mar.09,2010 4/7 walsin technology corporation 566-1,kao-shi road, 5 lin, yang-mei, tao-yuan, taiw an www.passivecomponent.com 8. packaging dimension and quantity paper tape size thickness (mm)/symbol 7 reel 13 reel 0402 0.500.05 n 10k 20k 0603 0.800.07 s 4k 15k 0805 0.600.10 a 4k 15k unit:pieces 9. electrical characteristics ? q factor specification vs. specific frequency ? q factor specification vs. specific frequency qvaluecriteriavs.specificfrequency hhseries,0402 1 10 100 1000 10000 0.1 1 10 100 capacitance(pf) q minimum(solidline) typical(brokenline) 1ghz 500mhz 100mhz fig.2qfactorspecificationvs.specificfrequenc yfor0402 qvaluecriteriavs.specificfrequency hhseries,0603 1 10 100 1000 10000 0.1 1 10 100 capacitance(pf) q minimum(solidline) typical(brokenline) 1ghz 500mhz 100mhz fig.3qfactorspecificationvs.specificfrequenc yfor0603
multilayer ceramic capacitors high q / low esr series (hh) 00 - t006 g - as_hh revisiong mar.09,2010 5/7 walsin technology corporation 566-1,kao-shi road, 5 lin, yang-mei, tao-yuan, taiw an www.passivecomponent.com ? typical esr vs. frequency ? typical impedance vs. frequency ? srf vs. capacitance 0402 "hh" series 0.01 0.1 1 100 1,000 10,000 frequency (mhz) esr (ohm) 1pf 5pf 10pf 100pf fig.4esrvs.frequency0402 0603 "hh" series 0.01 0.1 1 10 100 1,000 10,000 frequency (mhz) esr (ohm) 1pf 4.7pf 10pf 68pf fig.5esrvs.frequency0603 0402 "hh" series 0.1 1 10 100 1000 10000 100000 10 100 1,000 10,000 frequency (mhz) impedance (ohm) 1pf 4.7pf 10pf 100pf fig.6impedancevs.frequency0402 0603 "hh" series 0.1 1 10 100 1000 10000 100000 10 100 1,000 10,000 frequency (mhz) impedance (ohm) 1pf 4.7pf 10pf 68pf fig.7impedancevs.frequency0603 100 1,000 10,000 1 10 100 capacitance (pf) series reasonant frequency (mhz) 0402 0603 fig.8srfvs.capacitance
multilayer ceramic capacitors high q / low esr series (hh) 00 - t006 g - as_hh revisiong mar.09,2010 6/7 walsin technology corporation 566-1,kao-shi road, 5 lin, yang-mei, tao-yuan, taiw an www.passivecomponent.com appendixes ? tape & reel dimensions ? description of customer label fig.10thedimensionofreel fig.9thedimensionofpapertape size 0402, 0603,0805 reel size 7 13 c 13.0+0.5/-0.2 13.0+0.5/-0.2 w 1 8.4+1.5/-0 8.4+1.5/-0 a 178.00.10 330.01.0 n 60.0+1.0/-0 1001.0 a.customername b.wtcorderseriesanditemnumber c.customerp/o d.customerp/n e.descriptionofproduct f.quantity g.barcodeincludingquantity&wtcp/norcustome r h.wtcp/n i.shippingdate j.orderbarcodeincludingseriesanditemnumbers k.serialnumberoflabel size 0402 0603 0805 thickness n s a a 0 0.620.05 1.020.05 1.500.10 b 0 1.120.05 1.820.05 2.300.10 t 0.600.05 0.950.05 0.750.05 k 0 - - - w 8.000.10 8.000.10 8.000.10 p 0 4.000.10 4.000.10 4.000.10 10xp 0 40.00.10 40.00.10 40.00.10 p 1 2.000.05 4.000.10 4.000.10 p 2 2.000.05 2.000.05 2.000.05 d 0 1.550.05 1.550.05 1.550.05 d 1 - - - e 1.750.05 1.750.05 1.750.05 f 3.500.05 3.500.05 3.500.05
multilayer ceramic capacitors high q / low esr series (hh) 00 - t006 g - as_hh revisiong mar.09,2010 7/7 walsin technology corporation 566-1,kao-shi road, 5 lin, yang-mei, tao-yuan, taiw an www.passivecomponent.com ? constructions ? storage and handling conditions (1) tostoreproductsat5to40 cambienttemperatureand20to70%.relatedhumidi tyconditions. (2) theproductisrecommendedtobeusedwithinoneye araftershipment.checksolderabilityincaseofs helflife extensionisneeded. cautions: a. dontstoreproductsinacorrosiveenvironmentsuc hassulfide,chloridegas,oracid.itmaycauseo xidization ofelectrode,whicheasilyberesultedinpoorsold ering. b. tostoreproductsontheshelfandavoidexposuret omoisture. c. dontexposeproductstoexcessiveshock,vibration ,directsunlightandsoon. ? recommended soldering conditions theleadfreeterminationmlccsarenotonlytobe usedonsmtagainstleadfreesolderpaste,butals osuitable againstleadcontainingsolderpaste.iftheoptimi zedsolderjointisrequested,increasingsoldering time,temperature andconcentrationofn 2 withinovenarerecommended. no. name np0 1 ceramicmaterial batio 3 based 2 innerelectrode agpdalloy 3 innerlayer ag 4 middlelayer ni 5 termination outerlayer sn(matt) fig.11theconstructionofmlcc fig.12recommendedirreflowsolderingprofilefor smtprocess withsnagcuseriessolderpaste. 4 / sec max over 60sec at least by natural cooling 4 / sec max over 60sec at least by natural cooling fig.13recommendedwavesolderingprofileforsmt process withsnagcuseriessolder.
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